Modular Design of High Temp Recuperator Using 3D Printing

Technology leads to reduced use of high temperature alloys for future CSP plants

The modular design concept effectively using high temperature nickel alloys provides an alternative and potential cost reduction to the printed circuit heat exchangers (PCHE). By leveraging the rapid advancement of AM technologies and combining Directed Energy Deposition (DED) and Laser-Power Bed Fusion (L-PBF), the modular design can significantly reduce the manufacturing cost of high-temperature heat exchangers such as the high temperature recuperator (HTR) in a sCO2 Brayton cycles, enabling CSP plants to reach the LCOE goal of $0.05/kWh by 2030.